发明名称 |
Film type photodegradable transfer material |
摘要 |
Disclosed herein is a film-type photodegradable transfer material, comprising: a support film; a resin protection layer; a photodegradable photoresist layer; and a cover film, wherein the resin protection layer has an adhesion force of 0.05 kgf or less. When the film-type photodegradable transfer material is used to form a fine circuit pattern, such as a printed circuit board or the like, the resolution of the pattern can be increased by minimizing the distance between a mask and a photosensitive resin layer at the time of exposure, and work can be performed in the form of a sheet or a roll to roll process can be applied to the work even when the support film has been removed before an exposure process. |
申请公布号 |
US8697328(B2) |
申请公布日期 |
2014.04.15 |
申请号 |
US20090995137 |
申请日期 |
2009.05.20 |
申请人 |
MOON HEE WAN;LEE BYEONG IL;KOLON INDUSTRIES, INC. |
发明人 |
MOON HEE WAN;LEE BYEONG IL |
分类号 |
G03F7/004;G03C8/00;G03F7/00 |
主分类号 |
G03F7/004 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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