| 摘要 |
The present invention relates to a circuit connecting material, a manufacturing method thereof, and a method for manufacturing a mounted body using the same. An anisotropic conductive film containing a polymeric resin, a polymerization initiator, conductive particles is attached to the electrode of a first electronic part. A second electronic part is arranged on the anisotropic conductive film. The upper surface of the second electronic part is pressed by a compression head. Wettability is improved and adhesion to a substrate can be improved since super-hydrophilic properties are expressed on anatase type active titanium oxide particles during temporal adhesion. |
