| 摘要 |
<p>The present invention relates to a collet for conveying a semiconductor chip that is used in the manufacturing of a semiconductor package and, more particularly, to a collet for picking up and conveying a semiconductor chip including a collect holder with a magnetic force where a vacuum application pipe, which is provided with a holder vacuum hole penetrating a lower portion, is formed to protrude in an upper portion and a plate coupling groove is provided on a bottom surface; a metallic material plate that is inserted into, coupled with, and magnetically attached to the plate coupling groove, and is provided with a plate vacuum hole at the center; and an adsorption rubber formed of an elastic material that is coupled with a bottom surface of the plate and is provided with a rubber vacuum hole at the center. Multiple rubber coupling holes are through-formed, turned one round along the shape of the plate, at an edge in proximity to the outer circumference of the plate in a peripheral portion of the plate vacuum hole of the plate, and the outer circumference of the adsorption rubber is configured to be in close contact by the rubber coupling hole during the coupling of the plate with the adsorption rubber. Accordingly, the peripheral portion can have a close coupling force during the process of the coupling of the adsorption rubber with the plate, and thus the excellent coupling force results in improved durability of the collet and an increase in the life thereof. In particular, the collet can be operated with stability and quality improvement can result during the manufacturing of a semiconductor package.</p> |
