| 摘要 |
The present invention relates to a thin film deposition apparatus, which according to the present invention includes: a reaction space in which a preset gas is supplied to perform a deposition process on a substrate, and an opening part for receiving and discharging the substrate is formed; a moving space in which the substrate is received/discharged by being connected to the reaction space and the opening part; and a door device formed in the outer part of the reaction space to selectively open/close the opening part. |
