| 摘要 |
A luminescence device used in a backlight unit for lighting or displaying may include: a substrate including at least two electrode patterns and LED chips which are provided over the substrate and include a phosphor provided thereon. A dam is provided over the substrate, and an encapsulation layer is provided over the substrate. The dam is spaced from the LED Chips, and the substrate comprises a direct copper bonding (DCB) substrate including a first copper layer, a second copper layer and a substrate body. |
