发明名称 LASER DICING SHEET-PEEL SHEET LAMINATED BODY, LASER DICING SHEET AND METHOD OF MANUFACTURING CHIP BODY
摘要 PROBLEM TO BE SOLVED: To provide a laser dicing sheet-a peel sheet laminated body in the state of storing the laminated body, which can be removed without causing malfunction, the laser dicing sheet formed by peeling the peel sheet from the laminated body, and a method of manufacturing a chip body manufactured by singulating a plate-like member with the laser dicing sheet.SOLUTION: A laser dicing sheet 10 has a base material 1 and an adhesive layer 3 laminated on one surface of the base material 1, a back surface 1A which is an opposite side surface facing to the adhesive layer 3 of the base materials 1, 2, has a first region 1a in which its surface roughness is less than 0.1 μm on the arithmetic average roughness Ra, and a second region 1b in which its surface roughness is equal to or more than 0.3 μm on the arithmetic average roughness Ra, the first region 1a contains a laser incident region 1c in which the laser is irradiated thereto at time of use, and the second region 1b is provided on a peripheral side of the laser dicing sheet 10 outer from the laser incident region 1c in a planar view.
申请公布号 JP2014063803(A) 申请公布日期 2014.04.10
申请号 JP20120206770 申请日期 2012.09.20
申请人 LINTEC CORP 发明人 SATO YOUSUKE;SATO AKINORI;MIYANAGA TOMOHARU
分类号 H01L21/301;B23K26/38;B23K26/40;C09J7/02;C09J201/00 主分类号 H01L21/301
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