| 摘要 |
PROBLEM TO BE SOLVED: To reduce a polishing speed distribution range in a pressurization area extending concentrically along a radial direction of a substrate, and increasing in-plane uniformity of a polished surface of the substrate, in order to improve a yield rate.SOLUTION: An elastic film 10 has a plurality of peripheral walls 10a-10h that demarcate and form a plurality of pressurization areas CA, EA and MA1-MA6 for applying pressure to a substrate W, and that are disposed concentrically. In the elastic film 10, at least one intermediate pressurization area, for example the intermediate pressurization areas MA5 and MA6, among the plurality of intermediate pressurization areas MA1-MA6 formed between a discoidal central pressurization area CA positioned in a center and an annular edge pressurization area EA positioned in an outermost periphery, has an area width in a radial direction which is set to an area width within a range in which a polishing speed response width does not change although the area width is changed. |
