发明名称 COMPOUND SEMICONDUCTOR DEVICE AND MANUFACTURING METHOD OF THE SAME
摘要 PROBLEM TO BE SOLVED: To achieve a compound semiconductor device which has no deterioration in withstanding voltage and no instability in an operation in a comparatively simple constitution, and which successfully achieves normally-off by obtaining a sufficiently high threshold voltage to thereby achieve high reliability and high withstanding voltage.SOLUTION: A compound semiconductor device comprises in each compound semiconductor layer: a first layer 3; a second layer 4 which is formed above the first layer 3 and has bandgap wider than that of the first layer 3; a third layer 5a which is formed above the second layer 4 and has a p-type conductivity type; a gate electrode 11 formed above the second layer 4 via the third layer 5a; a fourth layer 6 which is formed above the second layer 4 so as to contact the third layer 5a and has bandgap wider than that of the second layer 4; and a fifth layer 7 which is formed above the fourth layer 6 so as to contact the third layer 5a and has bandgap narrower than that of the fourth layer 6.
申请公布号 JP2014063928(A) 申请公布日期 2014.04.10
申请号 JP20120208845 申请日期 2012.09.21
申请人 FUJITSU LTD 发明人 NISHIMORI MICHIHITO;IMADA TADAHIRO;TAGI TOSHIHIRO
分类号 H01L21/337;H01L21/20;H01L21/338;H01L27/098;H01L29/778;H01L29/808;H01L29/812 主分类号 H01L21/337
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