| 摘要 |
FIELD: physics; control.SUBSTANCE: invention relates to space, aviation, radio engineering, instrument-making and mechanical engineering and can be used in all industries for automatic control of the thermal state and functional parameters of technical devices. The method for automatic control of the thermal state and functional parameters of technical devices involves setting and determining the type and parameters of thermal functions of technical devices, from which values of thermal functions during operation of the devices and downtime thereof are calculated, and making adjustments in actuating devices through a numerical control computer system upon reaching the calculated values of set acceptable values. The method involves determining the type, the time variation characteristics of standard laws of thermal functions of the position, movement and state of technical devices, heat-loaded parts thereof, assemblies and components during heating and cooling thereof for each controlled functional parameter during operation of a technical device and during downtime thereof. Statistical characteristics of the time variation of thermal functions of heating and cooling for each controlled functional parameter during operation of the device and during downtime thereof are established during multiple tests. The obtained characteristics of the time variation of thermal functions in the working volume of the technical device during operation and downtime thereof are then used to calculate the value and/or position and/or movement and/or state of the controlled functional parameter in accordance with the operating time or downtime, for the current range of positions, movements and states of heat-loaded parts, assemblies and components of technical devices, and when values and/or positions and/or movements and/or states reach, with given probability, set acceptable values, the controlled functional parameter of the technical device is adjusted through a numerical control computer system by changing and acting on current parameters and functioning characteristics which define the level of the thermal conditions or state of heat-loaded devices.EFFECT: high accuracy of functioning of technical devices, high reliability thereof, stability of maintaining the level or range of values of functional output parameters of the position, movement and state of technical devices during operation thereof, carried out without using additional mechanisms, devices and systems for measuring temperature and/or thermal deformations and/or the position and/or movement and/or state of heat-loaded parts of devices.6 dwg |
