| 摘要 |
PROBLEM TO BE SOLVED: To provide a light-emitting diode package having enhanced safety, and a method for manufacturing the same.SOLUTION: A light-emitting diode package comprises: a substrate; a first electrode structure and a second electrode structure embedded in the substrate; and a plurality of light-emitting diode chips electrically connected to the first electrode structure and the second electrode structure. The first electrode structure has a first electrode and a second electrode disposed separately from each other, and the first electrode and the second electrode are embedded in the substrate and their bottom surfaces are exposed from the substrate. The second electrode structure has a third electrode positioned between the first electrode and the second electrode, the third electrode is embedded in the substrate and its bottom surface is positioned inside the substrate, and the light-emitting diode chips are electrically and respectively connected to the first electrode, the second electrode and the third electrode. |
