发明名称 METHODS OF FORMING AN ARRAY OF OPENINGS IN A SUBSTRATE, RELATED METHODS OF FORMING A SEMICONDUCTOR DEVICE STRUCTURE, AND A RELATED SEMICONDUCTOR DEVICE STRUCTURE
摘要 A method of forming an array of openings in a substrate. The method comprises forming a template structure comprising a plurality of parallel features and a plurality of additional parallel features perpendicularly intersecting the plurality of additional parallel features of the plurality over a substrate to define wells, each of the plurality of parallel features having substantially the same dimensions and relative spacing as each of the plurality of additional parallel features. A block copolymer material is formed in each of the wells. The block copolymer material is processed to form a patterned polymer material defining a pattern of openings. The pattern of openings is transferred to the substrate to form an array of openings in the substrate. A method of forming a semiconductor device structure, and a semiconductor device structure are also described.
申请公布号 US2014097520(A1) 申请公布日期 2014.04.10
申请号 US201213646131 申请日期 2012.10.05
申请人 MICRON TECHNOLOGY, INC. 发明人 MILLWARD DAN B.
分类号 H01L21/32;H01L29/06 主分类号 H01L21/32
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