| 摘要 |
PROBLEM TO BE SOLVED: To provide a semiconductor manufacturing method which can easily manufacture a semiconductor device capable of easily controlling a thickness of a support member, and stably reducing a stress due to thermal strain, and improving output characteristics.SOLUTION: A manufacturing method of a semiconductor device in which a semiconductor element is mounted on a substrate via a support member comprises: a process of forming at least three recesses independent from each other on the substrate 10 in a region for mounting a semiconductor element 20; a process of coating a liquid first resin composed of a material different from that of the substrate on the recesses; a process of filling the recesses by hardening the first resin and forming in respective recesses, at least three first support members 12 which are independent from each other and each has a dome-like shape raised from a substrate surface; a process of coating a liquid second resin so as to cover all of the first support members arranged in respective recesses; a process of mounting a semiconductor element on the second resin; and a process of hardening the second resin to form a second support member 13. |
