| 摘要 |
PROBLEM TO BE SOLVED: To provide an epoxy resin composition for an electronic material which has excellent low viscosity property and moldability, is excellent in heat resistance, particularly thermal decomposition stability in the presence of oxygen from a viewpoint of practicality and further has excellent performance in moisture resistance, low thermal expansivity and thermal conductivity, and a cured product thereof.SOLUTION: There are provided an epoxy resin composition which is composed of an epoxy resin, a curing agent and an inorganic filler, where the epoxy resin composition contains 70 wt.% or more of an inorganic filler, a diketone-based epoxy resin is used as an epoxy resin component, a phenol compound having two or more hydroxyl groups in one molecule and a melt viscosity at 150°C of 50 to 500 Pas is used as a curing agent component, and a cured product of the epoxy resin composition. |
