| 摘要 |
In a method for electrodepositing a layer of Pb-Sn on a bearing structure, which has been formed by electroplating a layer Pb-Cu-Sn on ametal substrate, the improvement is that after Pb-Cu-Sn plating, the substrate is rinsed in an aq. rinse media. The media is contacted with Pb, Sn or their alloys to replace Cu ions in the media with Pb and/or Sn ions and to deposit Cu on the remainder of the Pb and/or Sn, prior to electroplating the substrate with Pb-Sn. The treated rinse bath may be usem as a Pb-Sn plating path. The method minimizes waste rinse-water treatment problems.
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