METHOD OF MANUFACTURING PRINTED CIRCUIT BOARD

摘要

A method for manufacturing PCB is provided to miniaturize the electronic component and package component by solving the difficulty of the high density PCB manufacture due to the thickness of the plating formed in via and circuit pattern. The method for manufacturing PCB is as follows. The double-sided substrate conducted with inter-layer is prepared(100). An insulating layer is laminated onto the double-sided substrate (110). The stamper in which the raised pattern corresponding to via and circuit pattern is formed is provided and is compressed in the insulating layer(120). The stamper is separated from the insulating layer and forms an intaglio pattern corresponding to via and circuit pattern on the insulating layer(130). The conducting material charges into the intaglio pattern(140). The double-sided substrate is conducted with inter-layer by the conducting bump.