发明名称 SYSTEM AND METHOD FOR BRAZING TSP MATERIALS TO SUBSTRATES
摘要 Methods and systems of attaching a thermally stable polycrystalline diamond (TSP) material layer to a substrate. The methods include placing a braze material between the TSP material layer and the substrate, pressing at least one of the TSP material layer and substrate against the other of the TSP material layer and the substrate, heating the braze material to a temperature of at least 800° C., and cooling the braze forming a bond attaching the TSP material layer to the substrate.
申请公布号 US2014097159(A1) 申请公布日期 2014.04.10
申请号 US201313837416 申请日期 2013.03.15
申请人 SMITH INTERNATIONAL, INC. 发明人 BELNAP J. DANIEL;KESHAVAN MADAPUSI
分类号 B23K1/00 主分类号 B23K1/00
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