摘要 |
<p>A wet etching composition usable for etching a copper-based wiring layer includes between about 40% by weight to about 60% by weight of phosphoric acid, between about 1% by weight to about 10% by weight of nitric acid, between about 3% by weight to about 15% by weight of acetic acid, between about 0.01% by weight to about 0.1% by weight of a copper-ion compound, between about 1% by weight to about 10% by weight of a nitric salt, between about 1% by weight to about 10% by weight of an acetic salt, and a remainder of water</p> |
申请人 |
SAMSUNG DISPLAY CO., LTD. |
发明人 |
PARK, HONG-SICK;LEE, WANG-WOO;KIM, BONG-KYUN;CHOUNG, JONG-HYUN;PARK, YOUNG-WOO;KIM, GYU-PO;SEO, WON-GUK;SHIN, HYUN-CHEOL;HAN, SEUNG-YEON;LEE, KI-BEOM;CHO, SAM-YOUNG |