THERMALLY REACTIVE RESIST MATERIAL, METHOD FOR PRODUCING MOLD, MOLD, DEVELOPING METHOD, AND PATTERN-FORMING MATERIAL

摘要

A heat-reactive resist material contains copper oxide, and silicon or silicon oxide, and is formed so that the content of silicon or silicon oxide in the heat-reactive resist material is 4.0 mol% or more less than 10.0 mol% in terms of mole of silicon. A heat-reactive resist layer is formed using the heat-reactive resist material, is exposed, and then, is developed with a developing solution. Using the obtained heat-reactive resist layer as a mask, dry etching is performed on a substrate with a f luorocarbon to manufacture a mold having a concavo-convex shape on the substrate surface. At this point, it is possible to control a fine pattern comprised of the concavo-convex shape.