INTEGRATED CIRCUITS COMPRISING INSULATION MATERIAL AND USE OF SAID MATERIAL IN INTEGRATED CIRCUITS

摘要

The invention relates to the fields of microelectronics and materials sciences and concerns an insulation layer material for integrated circuits in microelectronics, which can be used, for example, in integrated circuits as insulation material in semiconductor components. The object of the present invention is to disclose an insulation material for integrated circuits, which has dielectric constants of k≰2 with good mechanical properties at the same time. The object is attained with an insulation material for integrated circuits, containing at least MOFs and/or COFs.