| 摘要 |
PROBLEM TO BE SOLVED: To provide a sheet peeling device capable of peeling an adhesive sheet by precisely applying a pressure corresponding to a width change even if the width of an adhesive sheet area changes immediately before being peeled off from an adherend, and to provide a peeling method. SOLUTION: The sheet peeling device 10 applies a peeling tape PT to the adhesive sheet S adhering to a semiconductor wafer W and peels off the adhesive sheet S via the peeling tape PT. The device includes a wire 51 pressing the region of the adhesive sheet S immediately before being peeled off from the semiconductor wafer W toward the semiconductor wafer W side. The wire 51 is pulled between width-changing pulleys 57, a part of which forms a peeling edge PE of the adhesive sheet S as a wire section 51A. A pressure is applied to the wafer W along the peeling edge PE of the adhesive sheet S even if a plane width of the adhesive sheet S changes by bringing the width-changing pulleys 57 closer to or separating from each other. COPYRIGHT: (C)2011,JPO&INPIT |
