发明名称 CONTACT AND CONTACT JOINT STRUCTURE
摘要 <p>The present invention relates to a contact capable of electrically connecting an electrically conductive portion provided on a plate-like member with an electrically conductive member different from the plate-like member. The contact of the present invention includes a main body that is to be soldered to the electrically conductive portion provided on the plate-like member, and is configured to have an opening; a movable portion, one end of which projects outwardly of the main body from the opening and the other of which is introduced inwardly of the main body from the opening, the movable portion being held by the main body so as to be reciprocable in directions of increasing and decreasing of a projecting amount thereof outwardly of the main body; and a biasing mechanism that biases the movable portion in such a direction that the projecting amount of the movable portion increases. The main body includes a tubular portion, a solder inflow suppressing portion capable of suppressing solder melted on an outer circumferential side of an abutting area between the solder inflow suppressing portion and the plate-like member from flowing into an inner circumferential side of the abutting area, and a soldering portion.</p>
申请公布号 EP2639884(A4) 申请公布日期 2014.04.09
申请号 EP20110840204 申请日期 2011.11.04
申请人 KITAGAWA INDUSTRIES CO., LTD. 发明人 KITANO, HIROKI;YUMI, HIDEO;NAKAMURA, TATSUYA
分类号 H01R4/02;H01R12/57;H01R12/58;H01R13/24;H05K1/02;H05K3/34 主分类号 H01R4/02
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