发明名称 Integral heat sink and housing light emitting diode assembly
摘要 A light assembly (20) for mounting to a planar support includes an extruded heat sink (22) presenting a mounting surface (24) and a heat transfer surface (26) slanted from an upper border (32) to a lower border (30). A panel block (52) depends from the lower border (30), a lens block (68) depends from the upper border (32), a back side (76) extends downwardly from the lens block (60), a truss member (82) interconnects the back side (76) and the heat transfer surface (26), and a mounting block (84) extends from the back side (76). The extruded heat sink (22) is cut into independent elongated sections (28) and light emitting diodes (44) are disposed thereon. The elongated sections (28) are mitered to one another to define a frame. A light directing panel (56) extends from the panel blocks (52) and a lens sheet (72) extends from the lens blocks (68).
申请公布号 US8690384(B2) 申请公布日期 2014.04.08
申请号 US20090996560 申请日期 2009.06.04
申请人 HOCHSTEIN PETER A.;RELUME TECHNOLOGIES, INC. 发明人 HOCHSTEIN PETER A.
分类号 F21V19/02 主分类号 F21V19/02
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