SEMICONDUCTOR PACKAGE APPARATUS

摘要

The present invention relates to a semiconductor package apparatus. The semiconductor package apparatus of the present invention includes a first semiconductor package which includes a first substrate, a solder resist layer which is installed in the first substrate, and a first sealing material which covers and protects the solder resist layer; and solder balls which include a first solder ball which is installed on the first substrate and has a first height, and a second solder ball which has a second height which is different from the first height. The first sealing material may include a perforation hole which is perforated in order to expose the solder balls.