| 摘要 |
<p>The present invention provides a surface protection member (10) for easily separating a protection member from the surface of a wafer (1) and not remaining adhesive (20) on the surface of a device and a method for processing the wafer using the surface protection member. The processing method fixes the surface protection member and the wafer by disposing the adhesive at the outside of a device region (3) and disposing the wafer on the surface protection member through corresponding the device region of the wafer and a concavo-convex absorbing member (14) disposed at a concave part (12) of the surface protection member (fixing step); maintains a surface protection member side with a maintenance table (21) for grinding a rear surface (1b) of the wafer with a grinding means (22) so as to separate in a particular thickness (grinding step); and removes the surface protection member from the wafer (removing step). The separation is facilitated by locally disposing the adhesive at the outside of the device region. The adhesive is not remaining on the surface of the device.</p> |
