A print head die is described. In one example, the print head die includes a substrate having liquid feed slots formed therein extending along a major dimension of the substrate and nozzles extending along opposite sides of each of the liquid feed slots; and electrical interconnect formed on the substrate along the major dimension adjacent a last one of the liquid feed slots. A first one of the liquid feed slots opposite the last liquid feed slot and farthest from the electrical interconnect supplies an ink using a higher drop volume than inks in other ones of the liquid feed slots. The last liquid feed slot supplies an ink having a higher contrast with the ink in the first liquid feed slot than with inks in other ones of the liquid feed slots.
