发明名称 METHOD OF APPLYING A STRESS RELIEVING MATERIAL TO AN EMBEDDED MAGNETIC COMPONENT
摘要 <p>A method of manufacturing a substrate includes providing a substrate with a cavity and a post in the cavity, dispensing an elastic filling material in the cavity, inserting a magnetic core including a core hole such the post extends through the core hole, curing the elastic filling material, forming holes in the substrate outside of the cavity and in the post, and forming via-in-via structures in the holes.</p>
申请公布号 WO2014051701(A1) 申请公布日期 2014.04.03
申请号 WO2013US32667 申请日期 2013.03.15
申请人 MULTI-FINELINE ELECTRONIX, INC. 发明人 MARCOCI, CIPRIAN
分类号 H01F17/00;H01F27/29 主分类号 H01F17/00
代理机构 代理人
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