| 摘要 |
PROBLEM TO BE SOLVED: To provide a phenolic molding compound capable of obtaining a formed part having fire retardant property and mechanical strength equivalent to conventional ones, without using halogen, antimony, or red phosphorus/organophosphorus flame retardant, and having heat dissipation as well.SOLUTION: A phenolic molding compound comprises: (A) a phenolic resin; (B) a metalhydroxide; (C) unfired clay; (D) a nitrogen compound; and (E) a heat dissipation filler. The phenolic molding compound preferably includes, in 100 parts by mass of phenolic molding compound: (A) 20-60 parts by mass of the phenolic resin; (B) 2-20 parts by mass of the metalhydroxide; (C) 1-20 parts by mass of the unfired clay; (D) 0.1-10 parts by mass of the nitrogen compound; and (E) 10-80 parts by mass of the heat dissipation filler. A formed part is obtained by molding and curing the phenolic molding compound. |
