发明名称 PEELING DEVICE, PEELING SYSTEM, AND PEELING METHOD
摘要 PROBLEM TO BE SOLVED: To improve the efficiencies of peeling process.SOLUTION: A peeling device comprises: a first holding part; a notch part; a measurement part; and a position adjustment part. The first holding part holds a first substrate of a superposed substrate formed by jointing a first substrate and the second substrate. The notch part notches to a junction between the first substrate and the second substrate. The measurement part measures a distance from a predetermined measurement reference position to a holding surface of the holding part, or a distance from the measurement reference position to an object between the measurement reference position and the holding surface. The position adjustment part adjusts a notch position of the notch part on the basis of the result of the measurement part and information previously obtained about the thickness of the superposed substrate.
申请公布号 JP2014060346(A) 申请公布日期 2014.04.03
申请号 JP20120205847 申请日期 2012.09.19
申请人 TOKYO ELECTRON LTD 发明人 HONDA MASARU;ITO MASANORI
分类号 H01L21/683;H01L21/304 主分类号 H01L21/683
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