SEMICONDUCTOR DEVICE MANUFACTURING METHOD

摘要

PROBLEM TO BE SOLVED: To provide a manufacturing method of a semiconductor device having good connection without voids and without warpage of a chip by flip-chip mounting and three-dimensional mounting via a thermosetting adhesive film.SOLUTION: A semiconductor device manufacturing method comprises in the following order: a process of laminating a thermosetting adhesive film 3 on a semiconductor chip 2 on a surface having bumps or on a substrate 4 on a surface having electrode pads 8; a process of forming a temporarily pressure bonded laminate by use of a heat tool to join the surface of the semiconductor chip 2 where the thermosetting adhesive film 3 is laminated and the surface of a substrate 4 where the electrode pads 8 are formed, or the surface of the semiconductor chip 2 where the bumps are formed and the surface of the substrate 2 where the thermosetting adhesive film 3 is laminated; a process of contacting and depressing under reduced pressure, an elastic member 11 to the substrate 4 side of the temporarily pressure bonded laminate and a high rigidity member 10 to the semiconductor chip 2 side of the temporarily pressure bonded laminate; and a process of fusing a solder 7 between the semiconductor chip 2 and the substrate 4 to cure the thermosetting adhesive film 3 by heating the temporarily pressure bonded laminate by the heat tool.