发明名称 POWER SUPPLY THERMAL PROFILE SELECTION MANAGEMENT
摘要 An electronic system employs multiple power supplies that provide electrical energy to components of the server system. Each power supply exhibits or experiences a uniquely different air flow within the system chassis. Different air flows correspond to different component temperatures for each power supply. Each power supply stores a collection of selectable thermal profiles that determine cooling element control within the power supply. Each thermal profile may correspond to a different physical location within the system. Thermal profiles provide each power supply with local environmental response correlations, such as between local power supply temperature and cooling fan speed. The power supply selects a particular thermal profile in response to determining the power supply's physical location in the system. The power supply instructs the cooling fan to provide an amount of cooling dependent on both the selected thermal profile and a sensed local environmental condition such as temperature.
申请公布号 US2014094986(A1) 申请公布日期 2014.04.03
申请号 US201314101347 申请日期 2013.12.10
申请人 INTERNATIONAL BUSINESS MACHINES CORPORATION 发明人 LIN JEN-CHING;MALIK RANDHIR SINGH
分类号 G05D23/19 主分类号 G05D23/19
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