发明名称 INTEGRATED LED LAMP WITH BUILT-IN GLUE HEAT DISSIPATION SYSTEM
摘要 An integrated LED lamp with a built-in glue heat dissipation system, which comprises a lamp shade (1), a lamp holder (7), a heat dissipation housing (6), a heat conducting plate (3), a power supply (5) and an LED chip (2). The glue heat dissipation system comprises the heat dissipation housing (6), the heat conducting plate (3) and heat conducting glue (4). A lower part of the heat dissipation housing is fixedly connected to the lamp holder, and an upper part is fixedly connected to the lamp shade. The heat conducting plate is fixedly connected to the upper part of the heat dissipation housing. The LED chip is attached onto the heat conducting plate. The heat conducting glue is filled in a space formed by the heat conducting plate and the heat dissipation housing, and the heat conducting glue enwraps the power supply. As the LED chip is attached onto the heat conducting plate, heat energy generated by the LED chip can be dissipated quickly; and as the heat conducting glue is filled in the space formed by the heat conducting plate and the heat dissipation housing, and the heat conductive glue enwraps the power supply, the heat energy can be dissipated uniformly and can be conducted to a surface of the heat dissipation housing. Problems of a single heat energy conducting path, large contact thermal resistance, high local temperature and low heat conducting efficiency are solved.
申请公布号 WO2014048049(A1) 申请公布日期 2014.04.03
申请号 WO2013CN00142 申请日期 2013.02.16
申请人 SHANGHAI DANGOO ELECTRONICS CO., LTD.;WEN, GUOJUN 发明人 WEN, GUOJUN;QU, SONG;LOU, YONGFA
分类号 F21S2/00;F21V29/00;F21Y101/02 主分类号 F21S2/00
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