发明名称 EPOXY RESIN, CURABLE RESIN COMPOSITION, CURED PRODUCT THEREOF, AND PRINTED CIRCUIT BOARD
摘要 PROBLEM TO BE SOLVED: To provide an epoxy resin that has little change in heat resistance and exhibits low thermal expansion.SOLUTION: The epoxy resin, which results from the polyglycidyl etherification of the polycondensate of biphenol, naphthol compound, and formaldehyde, is characterized by containing polyfunctional compound (X) represented by structural formula (1), the content of the polyfunctional compound (X) being at least 30% by area ratio in a GPC measurement.
申请公布号 JP2014058632(A) 申请公布日期 2014.04.03
申请号 JP20120205635 申请日期 2012.09.19
申请人 DIC CORP 发明人 SATO YASUSHI
分类号 C08G59/32;H05K1/03 主分类号 C08G59/32
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