发明名称 |
LEAD FRAME FOR OPTICAL SEMICONDUCTOR DEVICE, LEAD FRAME FOR OPTICAL SEMICONDUCTOR DEVICE WITH RESIN, MULTIPLE MOUNTED COMPONENT OF LEAD FRAME, MULTIPLE MOUNTED COMPONENT OF LEAD FRAME WITH RESIN, OPTICAL SEMICONDUCTOR DEVICE AND MULTIPLE MOUNTED COMPONENT OF OPTICAL SEMICONDUCTOR DEVICE |
摘要 |
PROBLEM TO BE SOLVED: To provide a lead frame for an optical semiconductor device capable of restraining peel-off between a resin layer and a terminal part, and a lead frame for an optical semiconductor device with a resin.SOLUTION: A lead frame 10 is used for an optical semiconductor device having a plurality of terminal parts 11, 12 in which at least one of terminal parts is connected to an LED element 2, and a recess part M connected to outer peripheral sides of terminal parts 11, 12, is formed on at least of one corner of at least one of terminal parts 11, 12. |
申请公布号 |
JP2014060371(A) |
申请公布日期 |
2014.04.03 |
申请号 |
JP20120206164 |
申请日期 |
2012.09.19 |
申请人 |
DAINIPPON PRINTING CO LTD |
发明人 |
ODA KAZUNORI;OISHI MEGUMI |
分类号 |
H01L33/62;H01L23/48 |
主分类号 |
H01L33/62 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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