Disclosed is a device for cutting lug residues. The device for cutting lug residues in accordance with an embodiment of the present invention includes a cutting device main body on which a wheel is installed; a pair of cutting units which is installed in the cutting device main body to be able to move relatively and cuts a cutting target object by facing each other across the cutting target object; and a pressing unit which moves one or more cutting units to be crossed in a moving direction of the cutting device main body by being installed in the cutting device main body and closely arranges one or more cutting units to the cutting target object.
申请公布号
KR20140040376(A)
申请公布日期
2014.04.03
申请号
KR20120106899
申请日期
2012.09.26
申请人
SAMSUNG HEAVY IND. CO., LTD.
发明人
PARK, SOON WOOK;KIM, DAE YOUNG;JUN, WAN LYUL;LEE, SANG HEON