发明名称 SUBSTRATE FOR POWER MODULE WITH HEAT SINK, POWER MODULE WITH HEAT SINK AND MANUFACTURING METHOD OF SUBSTRATE FOR POWER MODULE WITH HEAT SINK
摘要 PROBLEM TO BE SOLVED: To provide a substrate for a power module with a heat sink, which has low initial heat resistance and inhibits the occurrence of cracks in an insulation layer under heat cycle load, and which can inhibit raise of heat resistance; and to provide a power module with a heat sink equipped with the substrate for the power module with the heat sink and a manufacturing method of the substrate for the power module with the heat sink.SOLUTION: In a substrate for a power module with a heat sink, a metal layer 13 and a heat sink 31 are composed of Cu or a Cu alloy; and a junction material formed from Al or an Al alloy is formed between the metal layer 13 and the heat sink 31. The metal layer 13 and the heat sink 31 are solid-phase diffusion bonded with the junction material.
申请公布号 JP2014060216(A) 申请公布日期 2014.04.03
申请号 JP20120203356 申请日期 2012.09.14
申请人 MITSUBISHI MATERIALS CORP 发明人 TERASAKI NOBUYUKI;NAGATOMO YOSHIYUKI
分类号 H01L23/36 主分类号 H01L23/36
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