| 发明名称 |
RADIATION-CURING ADHESIVE TAPE FOR DICING |
| 摘要 |
<p>Provided is a radiation-curing adhesive tape for dicing capable of easy pickup without any residual adhesive in the pickup step even for, e.g., a semiconductor chip on which a through electrode is provided. This radiation-curing adhesive tape (1) for dicing has a radiation-curing adhesive layer (3) provided on a substrate sheet (2), wherein the tape is characterized in that Young's modulus after radiation curing/Young's modulus before radiation curing, which is the ratio of the Young's modulus after radiation curing to the Young's modulus before radiation curing, is 1.0-1.8.</p> |
| 申请公布号 |
WO2014050763(A1) |
申请公布日期 |
2014.04.03 |
| 申请号 |
WO2013JP75561 |
申请日期 |
2013.09.20 |
| 申请人 |
FURUKAWA ELECTRIC CO.,LTD. |
发明人 |
OTA, SATOSHI;TAMAGAWA, YURI;YABUKI, AKIRA;HATTORI, SATOSHI |
| 分类号 |
H01L21/301;C09J7/02;C09J201/00 |
主分类号 |
H01L21/301 |
| 代理机构 |
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