| 摘要 |
<p>Provided are a substrate for an optical device package, the optical device package including the same, and a manufacturing method thereof. The substrate for the optical device package includes an insulation layer and a circuit pattern which is formed on one side of the insulation layer and includes aluminum. According to the present invention, it is unnecessary to form a separate plating layer for a bonding process, as the circuit pattern is formed of aluminum foil. Therefore, the number of manufacturing processes is reduced in comparison with an existing optical device package manufacturing process using copper foil.</p> |
