发明名称 Light-emitting diode package
摘要 Disclosed is a light-emitting diode (LED) package (100) according to an embodiment, including: a body (110) having a cavity (130) formed therein, a lead frame (140) placed in the cavity, and an LED (120) electrically connected to the lead frame while having a slope angle (˜1) relative to the bottom surface of the cavity, wherein a light emitting part and a non-light emitting part are present on the LED (120), and wherein a connection part is provided in a region of the cavity to be connected to at least a region of the non-light emitting part.
申请公布号 EP2533312(A3) 申请公布日期 2014.04.02
申请号 EP20120159844 申请日期 2012.03.16
申请人 LG INNOTEK CO., LTD. 发明人 LEE, SANGWOO;WON, SUNGHEE
分类号 H01L33/48;H01L25/075;H01L33/62 主分类号 H01L33/48
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