摘要 |
Disclosed is a light-emitting diode (LED) package (100) according to an embodiment, including: a body (110) having a cavity (130) formed therein, a lead frame (140) placed in the cavity, and an LED (120) electrically connected to the lead frame while having a slope angle (˜1) relative to the bottom surface of the cavity, wherein a light emitting part and a non-light emitting part are present on the LED (120), and wherein a connection part is provided in a region of the cavity to be connected to at least a region of the non-light emitting part. |