| 摘要 |
PROBLEM TO BE SOLVED: To provide a holding table for holding a workpiece in the state of being supported on an annular frame while using a sensor for accurately detecting the machining amount of the workpiece, and to provide a grinding device. SOLUTION: A chuck table 37 is provided for holding a workpiece unit 101 supporting a semiconductor wafer W in an opening portion of the annular frame 102. It includes a workpiece holding part 73 arranged in opposition to machining units 33, 34, 35 which grind or polish the semiconductor wafer W, and having a workpiece holding surface 73a formed to hold the semiconductor wafer W, a plurality of suction pads 76 having frame holding surfaces formed under the machined surface of the semiconductor wafer W to hold the annular frame 102, and a reference block part 74 having a detection reference surface 74a formed around the plurality of suction pads 76 of the contact sensor 45 to detect the machining amount of the semiconductor wafer W during machining by the machining units 33, 34, 35. COPYRIGHT: (C)2011,JPO&INPIT |
