| 摘要 |
<p>A bonded structure is formed by and adding a first adhesive 5 into a region bounded by substrates 1, 2 and a containment means 3a, 3b. The containment means at least partially, preferably completely, around a region 9 between the substrates 1, 2. The containment means 3a, 3b is preferably a deformable seal or tape, or a second adhesive that cures quicker than the first adhesive 5. The containment means 3a, 3b is preferably electrically conductive. The bonded structure is used in ground vehicles.</p> |
