发明名称 Cooling enhancements in thin films using flexible complex seal due to temperature increase or thermal load increase
摘要 A cooling enhancement apparatus includes a first substrate and a second substrate, the first substrate having a face in contact with at least one hot medium and having another face in contact with a secondary gas. The second substrate includes a face in contact with the secondary gas and has the other face in contact with a main gas. The faces of the first and second substrates in contact with the secondary gas generally oppose each other. One or more flexible seals can be attached to the first substrate and to the second substrate to form one or more closed enclosures including the secondary gas so that the second substrate moves relative to the first substrate when the secondary gas undergoes volumetric thermal expansion.
申请公布号 US8684274(B2) 申请公布日期 2014.04.01
申请号 US201113026477 申请日期 2011.02.14
申请人 VAFAI KAMBIZ;KHALED ABDUL RAHIM A.;KAMBIX INNOVATIONS, LLC 发明人 VAFAI KAMBIZ;KHALED ABDUL RAHIM A.
分类号 G05D23/00 主分类号 G05D23/00
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