发明名称 Structure and fabrication method for resistance-change memory cell in 3-D memory
摘要 A memory device in a 3-D read and write memory includes a resistance-changing layer, and a local contact resistance in series with, and local to, the resistance-changing layer. The local contact resistance is established by a junction between a semiconductor layer and a metal layer. Further, the local contact resistance has a specified level of resistance according to a doping concentration of the semiconductor and a barrier height of the junction. A method for fabricating such a memory device is also presented.
申请公布号 US8686419(B2) 申请公布日期 2014.04.01
申请号 US201113029361 申请日期 2011.02.17
申请人 KREUPL FRANZ;SEKAR DEEPAK C;SANDISK 3D LLC 发明人 KREUPL FRANZ;SEKAR DEEPAK C
分类号 H01L45/00 主分类号 H01L45/00
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