| 摘要 |
A spring probe pin according to the present invention is capable of minimizing loss and distortion of electric signals transferred between electronic components, such as a semiconductor wafer, an LCD module, a semiconductor package, and various sockets, minimizing a physical size, and maximizing the life of the spring probe. The spring probe pin according to the present invention has a structure in which all or part of an upper probe is made of a specific metal, or has a structure in which all or part of a lower probe is made of a specific metal. Also, the spring probe pin comprises: an upper probe including an upper probe body and an upper probe connection part extending from the upper probe body and integrally formed with the upper probe body; a lower prove including a lower prove body and a lower probe connection part extending from the lower probe body and integrally formed with the lower probe body; and a spring for applying an elastic force to the upper probe and the lower probe when at least the upper probe connection part of the upper probe and the lower probe connection part are in a surface contact state, wherein the upper probe and the lower probe are electrically connected to each other through the upper probe connection part and the lower connection probe part, and the upper probe connection part and the lower connection probe part slide in a mutually contacted state. |
