SEMICONDUCTOR DEVICE AND METHOD FOR MANUFACTURING THE SAME

摘要

The present invention relates to a semiconductor device and a method for manufacturing the same and, more specifically, to a semiconductor device with a fiducial die to accurately recognize the laser drilling position of a molding compound resin when a fan-out package of a wafer level is manufactured and a method for manufacturing the same. The present invention provides the semiconductor device to form a via hole at an accurate position and interval by the laser drilling from the surface of the molding compound resin to a lower redistribution line around each semiconductor chip by forming the fiducial die for recognizing a reference coordinate position in laser drilling around the semiconductor chip when multiple chips are attached to an adhesive surface at constant intervals.