SEMICONDUCTOR DEVICE MANUFACTURING METHOD

摘要

PROBLEM TO BE SOLVED: To provide a semiconductor device manufacturing method which controls a tapered shape of an inlet port of a via hole.SOLUTION: A semiconductor device manufacturing method comprises: forming an insulator layer 20 on a conductive layer 18 on a substrate; forming a via hole 22 which pierces the insulator layer 20; forming a resist 32 in the via hole 22; forming a mask 33 on the insulator layer 20 and the on the resist 32; forming a resist 34 on the mask 33; patterning an opening for forming a wiring groove in the resist 34, that is, patterning the resist 34 so as to form a correction pattern 34a near a position right above the via hole 22; etching the mask 33 by using the resist 34 as a mask; etching the insulator layer 20 by using the mask 33 as a mask halfway down a depth to form a wiring groove; removing the resist 32 in the via hole 22; and embedding a conductor in the via hole 22 and in the wiring groove to form embedded wiring connected to the conductive layer 18.