发明名称 |
IMPLEMENTING MICROSCALE THERMOACOUSTIC HEAT AND POWER CONTROL FOR PROCESSORS AND 3D CHIPSTACKS |
摘要 |
A method and apparatus are provided for implementing microscale thermoacoustic heat and power control for processors and three dimensional (3D) chip stacks. A thermoacoustic heat engine is integrated with a 3D chip-stack and high power processors. The thermoacoustic heat engine is used in cooperation with a heat sink associated with the 3D chip-stack. Predefined connecting layers connect the 3D chip-stack to a cooling end of a thermoacoustic stack of the thermoacoustic heat engine, allowing the cooled end of the resonator to maintain temperature within the 3D chip-stack and to increase the efficiency of the heat sink. |
申请公布号 |
US2014083094(A1) |
申请公布日期 |
2014.03.27 |
申请号 |
US201213624051 |
申请日期 |
2012.09.21 |
申请人 |
INTERNATIONAL BUSINESS MACHINES CORPORATION |
发明人 |
ELISON BRET P.;MANN PHILLIP V.;SINHA ARVIND K. |
分类号 |
F01B19/00 |
主分类号 |
F01B19/00 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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