发明名称 PRINTED CIRCUIT BOARD AND METHOD FOR MANUFACTURING SAME
摘要 A printed circuit board includes a first trace layer, a first dielectric layer, a second trace layer, a second dielectric layer, a third trace layer, a third dielectric layer and a fourth trace layer arranged in that order. A cavity is defined in the printed circuit board running through from the fourth trace layer to the second dielectric layer. Portion of the second dielectric layer is exposed in the cavity. Surfaces of the fourth trace layer combining with the second dielectric layer, and surfaces of the second trace layer combining with the first dielectric layer, are all roughened to increase the strength of adhesion.
申请公布号 US2014083744(A1) 申请公布日期 2014.03.27
申请号 US201313949237 申请日期 2013.07.24
申请人 ZHEN DING TECHNOLOGY CO., LTD. 发明人 HU WEN-HUNG
分类号 H05K1/02;H05K3/00 主分类号 H05K1/02
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