EPOXY RESIN COMPOSITION FOR INSULATION, INSULATING FILM, PREPREG, AND PRINTED CIRCUIT BOARD

摘要

The present invention provides: an epoxy resin composition for insulation which contains a LiCl/DMAc cellulose aqueous solution or LiCl/DMF cellulose aqueous solution, a liquid oligomer or a soluble liquid thermosetting oligomer, an epoxy resin, and inorganic filler; an insulating film produced by using the same; prepreg; and a printed circuit board. The epoxy resin composition for insulation the insulating film, and the prepreg have low thermal expansion rate, high glass transition temperature, and high hardness.