| 摘要 |
PROBLEM TO BE SOLVED: To provide an inspection method of a semiconductor device which can identify a defective part of the semiconductor device without breaking the semiconductor device.SOLUTION: The inspection method of a semiconductor device includes: a first process of performing a first step of applying a pulse wave to each of a plurality of measurement positions through a coaxial probe 15 connected to each of the plurality of measurement positions of a diode 5 which is a semiconductor element, and a second step of measuring a reflection wave which is a pulse wave reflected from the diode 5 through the coaxial probe 15, sequentially for each of the plurality of measurement positions; and a second process of calculating a defective part 2 of the diode 5 on the basis of a plurality of reflection waves measured at the plurality of measurement positions. |
