| 摘要 |
PROBLEM TO BE SOLVED: To provide a film for a pre-installation type semiconductor sealing which can be used in a pre-installation type flip chip packaging because it is not cured at pre-heating for flip chip packaging but it is cured at flip chip packaging.SOLUTION: A film for a pre-installation type semiconductor sealing contains (A) a liquid epoxy resin, (B) a thermoplastic resin, (C) a curing agent, (D) a potential curing accelerator heat-treated at 50 to 100°C and (E) an inorganic filler. |
